0010-27431 300mm的高温基座组件

Product Description

I. Product overview

0010-27431 300mm high temperature base assembly is a high temperature treatment equipment components designed for semiconductor manufacturing, material science research and other fields. The components are mainly used to support and heat 300mm diameter semiconductor wafers or other material substrates in high temperature environments to achieve specific process processes such as heat treatment, annealing, oxidation, diffusion, etc.

Two, the main components
Base body:
Materials: Usually made of high purity, high heat resistant materials, such as ceramics (such as alumina, aluminum nitride, etc.) or quartz, to ensure stability in high temperature environments and low pollution.
Structure: Designed to uniformly support 300mm diameter wafers and to have good heat conductivity to ensure uniform temperature distribution.
Heating element:
A heating element (such as resistance wire, electrothermal film, etc.) embedded in or below the base to provide a high temperature heat source.
The arrangement and power design of the heating elements ensure that the base surface temperature is uniform and controllable.
Temperature control system:
Includes a temperature sensor and a temperature controller to monitor the base temperature in real time and adjust the heating power as needed to maintain the set process temperature.
Gas piping system (if applicable) :
Some high-temperature base components may be equipped with a gas piping system to deliver process gases to the base surface or below the wafer for specific chemical reactions or gas atmosphere control.
Connections and fixtures:
Includes a connector for mounting the base component to the device and a fixture for holding the wafer.